What we offer

Chip-design services and tools

If you have a concrete chip design idea, you’re in the right place. Do you need to miniaturize a specific component in your product? Optimize power consumption? Protect against cloning and counterfeiting with a chip-based solution? There are many reasons to pursue a custom chip design.

If you already have in-house design expertise, G3C can help you find experienced partners for a specific application or target technology—for example, to extend your team’s capacity, gain access to foundries, or acquire specific functionality as chip IP.

If you can define your chip’s desired functionality but cannot implement it yourself, we will, after a feasibility check, connect you with competent design teams and turnkey offerings in Europe. In any case, contact us! The G3C team will get back to you promptly and guide you through the next steps.

Wafer-level processes and assembly technologies

Are you looking for a specific wafer-level or assembly process, or do you want to develop one? From simple thin-film deposition on a wafer substrate to full device development for a sensor, G3C connects you with the infrastructure of the APECS pilot line and other European pilot lines, as well as competent development teams to implement your idea.

A key focus of the German APECS pilot line is heterogeneous integration—for example, chiplets, stacked wafers, or direct (quasi-monolithic) integration on existing CMOS wafers. We connect you with service providers and provide access to tools and equipment for various packaging and assembly techniques, and we pre-screen your idea for an initial feasibility assessment. Contact us! The G3C team will get back to you and guide you through the next steps.

The right technology to implement your chip idea

If you want to solve a problem through an innovative product or a research project and believe that chip technology can help, G3C is the right place. We offer a free preliminary review of your concept by technology experts from Research Fab Microelectronics Germany and connect you with the right partners for the design and fabrication of your chip component.

With our overview of all European pilot lines and the German chip design ecosystem, we can more quickly identify the best teams for design, process development, heterogeneous integration, packaging, and testing. We can connect you with industry providers as well as R&D services from universities and non-university research institutions. Our focus is on the German APECS pilot line offerings in heterogeneous integration and chiplets, system-on-chip (SoC) design, photonics, RF circuits, and power electronics.