The G3C's particular expertise lies in the field of heterointegration, i.e., the connection of different chips or semiconductor processes in a microsystem. From chiplet-based SoCs to post-CMOS integrated sensor technology, we provide the infrastructure of the APECS pilot line and the design expertise of the participating institutions.
For all other topics, G3C cooperates with European partner institutions and pilot lines and offers a comprehensive point of contact for inquiries from Germany.
Give us a call or send us an email! We will also be presenting excerpts from the available services and infrastructure on the G3C website.
 Platform for semiconductor research, development, and innovation
                        Platform for semiconductor research, development, and innovation