Turning European exchange into concrete semiconductor collaboration

The German Chips Competence Centre participated in the 12th Minalogic Business Meetings in Grenoble to strengthen cooperation with partners across the European semiconductor ecosystem. A key focus was the exchange with Chips Competence Centres from the Netherlands, Sweden and France on technology transfer, access to semiconductor infrastructures and cross-border collaboration.

The discussions highlighted the complementary strengths of Europe's national semiconductor ecosystems. Topics ranged from rapid prototyping and access to pilot infrastructures to system integration, SME-focused collaboration, funding opportunities and design-to-manufacturing capabilities.

Across the exchanges, a common development became clear: Chips Competence Centres are increasingly serving as central interfaces between companies, expertise, infrastructures and partner networks. Shared priorities include accelerating the transfer of semiconductor technologies into applications, scaling pilot activities and strengthening skills in areas such as chip design, packaging, testing and reliability.

For start-ups and SMEs, closer cooperation between the European competence centres can facilitate faster access to suitable partners and infrastructures, improve the visibility of relevant funding opportunities and shorten the path from an initial idea to pilot activities and market-oriented development.

Following the meetings in Grenoble, G3C is consolidating new contacts and identifying potential areas for joint activities with European partners. Further cooperation formats are being explored, including a coordinated SME delegation to strengthen cross-border project development and collaboration.