G3C Project Manager Alexander Stanitzki participated in a panel discussion on start-ups and SMEs at the Chipdesign Germany Forum 2026 in Dresden. Together with founders, industry representatives and incubator experts, the panel discussed key barriers to scaling semiconductor start-ups in Europe.

Market access and financing emerged as central challenges. Participants highlighted difficulties for young companies in becoming suppliers to established European industry, as well as lengthy public funding procedures and differences in private financing and venture capital ecosystems across Europe.

The discussion also addressed the importance of strengthening entrepreneurial culture at universities and connecting technical founders with business expertise. Potential measures ranged from stronger incentives for European sourcing to improving cross-border investment conditions.

For G3C, insights from the panel help identify where start-ups require support and how access to suitable partners, infrastructures and opportunities across the European semiconductor ecosystem can be improved.