G3C strengthens European connections at FIRST 2026

The German Chips Competence Centre participated in FIRST 2026 in Berlin, which brought together more than 500 representatives from industry, research and the European semiconductor ecosystem. The two-day conference provided an opportunity to exchange perspectives on current developments in microelectronics and strengthen connections with partners across Europe.

Among the discussions were exchanges with Régis Hamelin, coordinator of the European aCCCess initiative, and Romano Hoofman, Strategic Development Director at imec and coordinator of the EU Chips Design Platform (EuroCDP) and the EUROPRACTICE Service. Their respective initiatives play an important role in connecting semiconductor capabilities and facilitating access to expertise, design services and technology infrastructure across Europe.

For G3C, FIRST provided a valuable platform to expand its network and strengthen links between national and European initiatives. These connections support G3C’s role in helping companies and innovators identify and access suitable expertise, infrastructure and partners across the European semiconductor ecosystem.